1、 India's first silicon carbide wafer factory: SiCSem project analysis Project overview Leading unit: SiCSem (India)+Clas SiC Wafer Fab (UK) Site selection: "Information Valley" Industrial Park in Bhubaneswar, Odisha Planned production capacity: 60000 pieces/year SiC wafers 96 million pieces/year SiC power devices Production time: Expected 2026 Positioning: India's first commercial SiC wafer and device manufacturing base Industrial significance Silicon carbide (SiC) is one of the core materials of third-generation semiconductors, with high voltage resistance, high frequency, high thermal conductivity and other characteristics, and has become a key material for high-voltage power scenarios such as new energy vehicles, power grid converters, charging piles, etc. Breaking the high dependence of SiC devices on imports and undertaking the policy dividends of new energy vehicles and renewable energy to accelerate India's independent and controllable layout in defense and high-voltage power electronics. It is worth noting that Clas SiC Wafer Fab is one of the few companies in the UK that has mastered SiC epitaxial and wafer manufacturing capabilities, providing important technical support for SiCSem. 2、 Four major projects are implemented in collaboration, covering three key nodes in the semiconductor industry chain SiCSem: Breakthrough in Material End - Introduction of Wide Bandgap Semiconductor Technology in Silicon Carbide Wafer+Device Manufacturing, Covering Upstream Wafer and Midstream Device Processes 2 3D Glass Solutions: Interlayer Packaging - Glass based+3D Heterogeneous Packaging Location: Same as Odisha Information Valley Capacity Planning: 69600 glass substrates/13200 3DHI modules/50 million packaging units/year Process Features: Integrated silicon bridges, passive devices, heterogeneous packaging Service Fields: AI chips, defense modules, high-performance computing 3 ASIP Technologies+APACT Korea: Large scale modulus production line for packaging and testing/power devices Location: Andhra Pradesh Capacity: 96 million power devices/year Product direction: Mainstream consumer and industrial chip packaging for mobile phones, set-top boxes, automotive electronics, etc. 4 New local infrastructure and employment supporting projects are expected to directly create 2034 technical positions, forming a local "high-tech agglomeration belt" and attracting overseas talents to return. III. Current situation and challenges of ISM promotion: from conception to manufacturing implementation. As of now, the total number of ISM supported projects has reached 10, with a total investment scale exceeding 1.6 trillion rupees (about 19.2 billion US dollars), covering six states, and industry directions including chip design and wafer manufacturing (such as Micron storage project), display panel production (Vedanta Group), packaging and integration packaging (such as Tata plan)

4、 Summary: The approval and layout of SiCSem silicon carbide wafer fab, a turning point in India's semiconductor strategy, means that India is no longer satisfied with chip packaging and testing or design outsourcing, but is beginning to touch the core material side of semiconductor manufacturing, especially in the strategic compound semiconductor field. With the introduction of advanced packaging and heterogeneous integration technologies, India is attempting to build an emerging ecosystem of "materials devices packaging systems" full chain collaboration. In the context of international geopolitical competition and industrial chain reshaping, India may become an important SiC device alternative manufacturing center in the Asia Pacific region, especially with a unique strategic position in serving the markets of South Asia, the Middle East, and Southeast Asia.